The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

Yu Hsiang Hsiao; Kwang Lung Lin

doi:10.1007/s10854-015-4011-2

The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

Yu Hsiang Hsiao
, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was investigated with and without current stressing. The high volume of PdSn₄ was formed in the as produced micro-bump joint. Electric current stressing caused the growth of and the conversion between PdSn₄ and Ni₃Sn₄. The conversion of PdSn₄ to Ni₃Sn₄ was accompanied by voids formation between the neighboring intermetallic compounds. The void formation was attributed to the volume difference between the two compounds.

Original language	English
Pages (from-to)	2201-2205
Number of pages	5
Journal	Journal of Materials Science: Materials in Electronics
Volume	27
Issue number	3
DOIs	https://doi.org/10.1007/s10854-015-4011-2
Publication status	Published - 2016 Mar 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1007/s10854-015-4011-2

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@article{b6acd809a1464c42a889e199d69e22f9,

title = "The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing",

abstract = "The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was investigated with and without current stressing. The high volume of PdSn4 was formed in the as produced micro-bump joint. Electric current stressing caused the growth of and the conversion between PdSn4 and Ni3Sn4. The conversion of PdSn4 to Ni3Sn4 was accompanied by voids formation between the neighboring intermetallic compounds. The void formation was attributed to the volume difference between the two compounds.",

author = "Hsiao, \{Yu Hsiang\} and Lin, \{Kwang Lung\}",

note = "Funding Information: One of the authors, Kwang-Lung Lin, appreciate the Ministry of Science and Technology of the Republic of China (Taiwan) for partial support of this study under NSC 101-2221-E-006-117-MY3. Publisher Copyright: {\textcopyright} 2015, Springer Science+Business Media New York.",

year = "2016",

month = mar,

day = "1",

doi = "10.1007/s10854-015-4011-2",

language = "English",

volume = "27",

pages = "2201--2205",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

number = "3",

}

TY - JOUR

T1 - The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

AU - Hsiao, Yu Hsiang

AU - Lin, Kwang Lung

N1 - Funding Information: One of the authors, Kwang-Lung Lin, appreciate the Ministry of Science and Technology of the Republic of China (Taiwan) for partial support of this study under NSC 101-2221-E-006-117-MY3. Publisher Copyright: © 2015, Springer Science+Business Media New York.

PY - 2016/3/1

Y1 - 2016/3/1

N2 - The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was investigated with and without current stressing. The high volume of PdSn4 was formed in the as produced micro-bump joint. Electric current stressing caused the growth of and the conversion between PdSn4 and Ni3Sn4. The conversion of PdSn4 to Ni3Sn4 was accompanied by voids formation between the neighboring intermetallic compounds. The void formation was attributed to the volume difference between the two compounds.

AB - The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was investigated with and without current stressing. The high volume of PdSn4 was formed in the as produced micro-bump joint. Electric current stressing caused the growth of and the conversion between PdSn4 and Ni3Sn4. The conversion of PdSn4 to Ni3Sn4 was accompanied by voids formation between the neighboring intermetallic compounds. The void formation was attributed to the volume difference between the two compounds.

UR - https://www.scopus.com/pages/publications/84957839858

UR - https://www.scopus.com/pages/publications/84957839858#tab=citedBy

U2 - 10.1007/s10854-015-4011-2

DO - 10.1007/s10854-015-4011-2

M3 - Article

AN - SCOPUS:84957839858

SN - 0957-4522

VL - 27

SP - 2201

EP - 2205

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 3

ER -

The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

Abstract

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