The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

Tsung Chieh Chiu; Kwang Lung Lin

doi:10.1016/j.intermet.2011.12.010

The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

Tsung Chieh Chiu
, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100°C, 2.6 × 10 ³ A/cm ² of current stressing. With electron flow from the Cu toward the Au, both Sn and Cu atoms migrated from the cathode to the anode, these phenomena also accompanied with the crack formation at the (Cu,Au) ₆Sn ₅/solder interface and the rapid dissolution of Cu consumed. The sequence of Au-Sn IMCs formed at the Au side upon electromigration (EM) is AuSn ₄/AuSn ₂/AuSn/Au ₅Sn while as AuSn ₄/AuSn ₂/AuSn for aging. At cathodic Au side, the voids were formed in the AuSn ₄ and at the AuSn ₄/solder interface due to the migration of Sn toward the anode. The voids formation in AuSn on both cathode and anode sides is due to the consumption of Sn by transformation of AuSn into Au ₅Sn.

Original language	English
Pages (from-to)	208-216
Number of pages	9
Journal	Intermetallics
Volume	23
DOIs	https://doi.org/10.1016/j.intermet.2011.12.010
Publication status	Published - 2012 Apr

All Science Journal Classification (ASJC) codes

General Chemistry
Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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10.1016/j.intermet.2011.12.010

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@article{10ac12d59e36438d951af48dd84bbe57,

title = "The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing",

abstract = "In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100°C, 2.6 × 10 3 A/cm 2 of current stressing. With electron flow from the Cu toward the Au, both Sn and Cu atoms migrated from the cathode to the anode, these phenomena also accompanied with the crack formation at the (Cu,Au) 6Sn 5/solder interface and the rapid dissolution of Cu consumed. The sequence of Au-Sn IMCs formed at the Au side upon electromigration (EM) is AuSn 4/AuSn 2/AuSn/Au 5Sn while as AuSn 4/AuSn 2/AuSn for aging. At cathodic Au side, the voids were formed in the AuSn 4 and at the AuSn 4/solder interface due to the migration of Sn toward the anode. The voids formation in AuSn on both cathode and anode sides is due to the consumption of Sn by transformation of AuSn into Au 5Sn.",

author = "Chiu, \{Tsung Chieh\} and Lin, \{Kwang Lung\}",

note = "Funding Information: The authors appreciate gratefully the National Science Council of Taiwan for the financial support of this work under grant NSC 98-2221-E-006-065-MY3 .",

year = "2012",

month = apr,

doi = "10.1016/j.intermet.2011.12.010",

language = "English",

volume = "23",

pages = "208--216",

journal = "Intermetallics",

issn = "0966-9795",

publisher = "Elsevier Limited",

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T1 - The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

AU - Chiu, Tsung Chieh

AU - Lin, Kwang Lung

N1 - Funding Information: The authors appreciate gratefully the National Science Council of Taiwan for the financial support of this work under grant NSC 98-2221-E-006-065-MY3 .

PY - 2012/4

Y1 - 2012/4

N2 - In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100°C, 2.6 × 10 3 A/cm 2 of current stressing. With electron flow from the Cu toward the Au, both Sn and Cu atoms migrated from the cathode to the anode, these phenomena also accompanied with the crack formation at the (Cu,Au) 6Sn 5/solder interface and the rapid dissolution of Cu consumed. The sequence of Au-Sn IMCs formed at the Au side upon electromigration (EM) is AuSn 4/AuSn 2/AuSn/Au 5Sn while as AuSn 4/AuSn 2/AuSn for aging. At cathodic Au side, the voids were formed in the AuSn 4 and at the AuSn 4/solder interface due to the migration of Sn toward the anode. The voids formation in AuSn on both cathode and anode sides is due to the consumption of Sn by transformation of AuSn into Au 5Sn.

AB - In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100°C, 2.6 × 10 3 A/cm 2 of current stressing. With electron flow from the Cu toward the Au, both Sn and Cu atoms migrated from the cathode to the anode, these phenomena also accompanied with the crack formation at the (Cu,Au) 6Sn 5/solder interface and the rapid dissolution of Cu consumed. The sequence of Au-Sn IMCs formed at the Au side upon electromigration (EM) is AuSn 4/AuSn 2/AuSn/Au 5Sn while as AuSn 4/AuSn 2/AuSn for aging. At cathodic Au side, the voids were formed in the AuSn 4 and at the AuSn 4/solder interface due to the migration of Sn toward the anode. The voids formation in AuSn on both cathode and anode sides is due to the consumption of Sn by transformation of AuSn into Au 5Sn.

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U2 - 10.1016/j.intermet.2011.12.010

DO - 10.1016/j.intermet.2011.12.010

M3 - Article

AN - SCOPUS:84856962010

SN - 0966-9795

VL - 23

SP - 208

EP - 216

JO - Intermetallics

JF - Intermetallics

ER -

The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

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