The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

Tsung Chieh Chiu; Kwang Lung Lin

doi:10.1016/j.scriptamat.2009.02.061

The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

Tsung Chieh Chiu, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence.

Original language	English
Pages (from-to)	1121-1124
Number of pages	4
Journal	Scripta Materialia
Volume	60
Issue number	12
DOIs	https://doi.org/10.1016/j.scriptamat.2009.02.061
Publication status	Published - 2009 Jun 1

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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abstract = "Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence.",

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N2 - Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence.

AB - Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence.

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