The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

Tsung Chieh Chiu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)

Abstract

Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence.

Original languageEnglish
Pages (from-to)1121-1124
Number of pages4
JournalScripta Materialia
Volume60
Issue number12
DOIs
Publication statusPublished - 2009 Jun 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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