The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

Shih Ming Kuo; Kwang Lung Lin

doi:10.1007/s11664-007-0209-2

The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

Shih Ming Kuo, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10 ³ A/cm ² for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.

Original language	English
Pages (from-to)	1378-1382
Number of pages	5
Journal	Journal of Electronic Materials
Volume	36
Issue number	10
DOIs	https://doi.org/10.1007/s11664-007-0209-2
Publication status	Published - 2007 Oct

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-007-0209-2

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title = "The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing",

abstract = "The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10 3 A/cm 2 for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.",

author = "Kuo, {Shih Ming} and Lin, {Kwang Lung}",

note = "Funding Information: Support for this study from the National Science Council of the Republic of China under NSC94-2216-E-006-014 is gratefully acknowledged.",

year = "2007",

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doi = "10.1007/s11664-007-0209-2",

language = "English",

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T1 - The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

AU - Kuo, Shih Ming

AU - Lin, Kwang Lung

N1 - Funding Information: Support for this study from the National Science Council of the Republic of China under NSC94-2216-E-006-014 is gratefully acknowledged.

PY - 2007/10

Y1 - 2007/10

N2 - The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10 3 A/cm 2 for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.

AB - The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10 3 A/cm 2 for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.

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JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

Abstract

All Science Journal Classification (ASJC) codes

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