The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

Shih Ming Kuo, Kwang Lung Lin

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10 3 A/cm 2 for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.

Original languageEnglish
Pages (from-to)1378-1382
Number of pages5
JournalJournal of Electronic Materials
Volume36
Issue number10
DOIs
Publication statusPublished - 2007 Oct 1

Fingerprint

Electromigration
lamella
electromigration
Compressive stress
Soldering alloys
Cathodes
Current density
solders
Atoms
cathodes
current density
cavities
room temperature
Temperature
atoms

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing. / Kuo, Shih Ming; Lin, Kwang Lung.

In: Journal of Electronic Materials, Vol. 36, No. 10, 01.10.2007, p. 1378-1382.

Research output: Contribution to journalArticle

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