TY - GEN
T1 - The HOY tester - Can IC testing go wireless?
AU - Wu, Cheng Wen
AU - Huang, Chih Tsun
AU - Huang, Shi Yu
AU - Huang, Po Chiun
AU - Chang, Tsin Yuan
AU - Hsing, Yu Tsao
PY - 2007/10/1
Y1 - 2007/10/1
N2 - Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted.
AB - Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted.
UR - http://www.scopus.com/inward/record.url?scp=34748849263&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34748849263&partnerID=8YFLogxK
U2 - 10.1109/VDAT.2006.258155
DO - 10.1109/VDAT.2006.258155
M3 - Conference contribution
AN - SCOPUS:34748849263
SN - 1424401798
SN - 9781424401796
T3 - 2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers
SP - 183
EP - 186
BT - 2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers
T2 - 2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006
Y2 - 26 April 2007 through 28 April 2007
ER -