The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy

H. Nakawaki; H. Tatsumi; C. Yang; S. Lin; H. Nishikawa

doi:10.23919/ICEP58572.2023.10129655

The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy

H. Nakawaki, H. Tatsumi, C. Yang, S. Lin, H. Nishikawa

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In recent years, low-melting-point solder is required in electronics packaging. Among them, Sn-Bi alloys are expected to exhibit good wettability. However, they have difficulty in ductility due to the brittle nature of Bi. In some research, to improve the mechanical property of Sn-Bi alloy, Zn and In are added. The modified alloy solder had better mechanical property and the low-melting-point such as Sn-58Bi. However, the strength of the joint part is not enough. Therefore, in this study, the joint properties of Sn-Bi alloys with Zn and In addition were evaluated by varying the Bi content.

Original language	English
Title of host publication	2023 International Conference on Electronics Packaging, ICEP 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	209-210
Number of pages	2
ISBN (Electronic)	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129655
Publication status	Published - 2023
Event	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan Duration: 2023 Apr 19 → 2023 Apr 22

Publication series

Name	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
Country/Territory	Japan
City	Kumamoto
Period	23-04-19 → 23-04-22

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Mechanics of Materials
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP58572.2023.10129655

Cite this

Nakawaki, H., Tatsumi, H., Yang, C., Lin, S., & Nishikawa, H. (2023). The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy. In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 209-210). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129655

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title = "The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy",

abstract = "In recent years, low-melting-point solder is required in electronics packaging. Among them, Sn-Bi alloys are expected to exhibit good wettability. However, they have difficulty in ductility due to the brittle nature of Bi. In some research, to improve the mechanical property of Sn-Bi alloy, Zn and In are added. The modified alloy solder had better mechanical property and the low-melting-point such as Sn-58Bi. However, the strength of the joint part is not enough. Therefore, in this study, the joint properties of Sn-Bi alloys with Zn and In addition were evaluated by varying the Bi content.",

author = "H. Nakawaki and H. Tatsumi and C. Yang and S. Lin and H. Nishikawa",

note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129655",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

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Nakawaki, H, Tatsumi, H, Yang, C, Lin, S & Nishikawa, H 2023, The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy. in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 209-210, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23-04-19. https://doi.org/10.23919/ICEP58572.2023.10129655

The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy. / Nakawaki, H.; Tatsumi, H.; Yang, C. et al.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 209-210 (2023 International Conference on Electronics Packaging, ICEP 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy

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AU - Nishikawa, H.

PY - 2023

Y1 - 2023

N2 - In recent years, low-melting-point solder is required in electronics packaging. Among them, Sn-Bi alloys are expected to exhibit good wettability. However, they have difficulty in ductility due to the brittle nature of Bi. In some research, to improve the mechanical property of Sn-Bi alloy, Zn and In are added. The modified alloy solder had better mechanical property and the low-melting-point such as Sn-58Bi. However, the strength of the joint part is not enough. Therefore, in this study, the joint properties of Sn-Bi alloys with Zn and In addition were evaluated by varying the Bi content.

AB - In recent years, low-melting-point solder is required in electronics packaging. Among them, Sn-Bi alloys are expected to exhibit good wettability. However, they have difficulty in ductility due to the brittle nature of Bi. In some research, to improve the mechanical property of Sn-Bi alloy, Zn and In are added. The modified alloy solder had better mechanical property and the low-melting-point such as Sn-58Bi. However, the strength of the joint part is not enough. Therefore, in this study, the joint properties of Sn-Bi alloys with Zn and In addition were evaluated by varying the Bi content.

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Nakawaki H, Tatsumi H, Yang C, Lin S, Nishikawa H. The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy. In 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 209-210. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129655

The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy

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