The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yu Wei Lin; Wun Bin Ke; Ren You Wang; I. Sheng Wang; Ying Ta Chiu; Kuo Chang Lu; Kwang Lung Lin; Yi Shao Lai

doi:10.1016/j.surfcoat.2012.07.033

The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yu Wei Lin, Wun Bin Ke, Ren You Wang, I. Sheng Wang, Ying Ta Chiu, Kuo Chang Lu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journal › Article › peer-review

18 Citations (Scopus)

Abstract

The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.

Original language	English
Pages (from-to)	599-603
Number of pages	5
Journal	Surface and Coatings Technology
Volume	231
DOIs	https://doi.org/10.1016/j.surfcoat.2012.07.033
Publication status	Published - 2013 Sept 25

All Science Journal Classification (ASJC) codes

General Chemistry
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1016/j.surfcoat.2012.07.033

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title = "The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad",

abstract = "The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.",

author = "Lin, {Yu Wei} and Ke, {Wun Bin} and Wang, {Ren You} and Wang, {I. Sheng} and Chiu, {Ying Ta} and Lu, {Kuo Chang} and Lin, {Kwang Lung} and Lai, {Yi Shao}",

note = "Funding Information: The authors acknowledge the support by National Science Council through grants 99-2221-E-006-131, 100-2628-E-006-025-MY2 and 98-2221-E-006 -065-MY3 .",

year = "2013",

month = sep,

day = "25",

doi = "10.1016/j.surfcoat.2012.07.033",

language = "English",

volume = "231",

pages = "599--603",

journal = "Surface and Coatings Technology",

issn = "0257-8972",

publisher = "Elsevier",

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TY - JOUR

T1 - The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

AU - Lin, Yu Wei

AU - Ke, Wun Bin

AU - Wang, Ren You

AU - Wang, I. Sheng

AU - Chiu, Ying Ta

AU - Lu, Kuo Chang

AU - Lin, Kwang Lung

AU - Lai, Yi Shao

N1 - Funding Information: The authors acknowledge the support by National Science Council through grants 99-2221-E-006-131, 100-2628-E-006-025-MY2 and 98-2221-E-006 -065-MY3 .

PY - 2013/9/25

Y1 - 2013/9/25

N2 - The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.

AB - The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.

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JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

ER -

The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

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