The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yu Wei Lin, Wun Bin Ke, Ren You Wang, I. Sheng Wang, Ying Ta Chiu, Kuo Chang Lu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.

Original languageEnglish
Pages (from-to)599-603
Number of pages5
JournalSurface and Coatings Technology
Volume231
DOIs
Publication statusPublished - 2013 Sep 25

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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