The interaction kinetics and compound formation between electroless NiP and solder

Chwan Ying Lee, Kwang Lung Lin

Research output: Contribution to journalArticle

96 Citations (Scopus)

Abstract

The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.

Original languageEnglish
Pages (from-to)201-206
Number of pages6
JournalThin Solid Films
Volume249
Issue number2
DOIs
Publication statusPublished - 1994 Sep 15

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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