The interaction kinetics and compound formation between electroless NiP and solder

Chwan Ying Lee, Kwang-Lung Lin

Research output: Contribution to journalArticle

95 Citations (Scopus)

Abstract

The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.

Original languageEnglish
Pages (from-to)201-206
Number of pages6
JournalThin Solid Films
Volume249
Issue number2
DOIs
Publication statusPublished - 1994 Sep 15

Fingerprint

solders
Soldering alloys
Intermetallics
intermetallics
Kinetics
kinetics
Diffractometers
interactions
Auger electron spectroscopy
diffractometers
Phosphorus
Auger spectroscopy
electron spectroscopy
phosphorus
Electron microscopes
Deposits
Activation energy
electron microscopes
deposits
activation energy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

@article{4086b49a413c4d24bc22f8c0a6a57282,
title = "The interaction kinetics and compound formation between electroless NiP and solder",
abstract = "The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.",
author = "Lee, {Chwan Ying} and Kwang-Lung Lin",
year = "1994",
month = "9",
day = "15",
doi = "10.1016/0040-6090(94)90761-7",
language = "English",
volume = "249",
pages = "201--206",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "2",

}

The interaction kinetics and compound formation between electroless NiP and solder. / Lee, Chwan Ying; Lin, Kwang-Lung.

In: Thin Solid Films, Vol. 249, No. 2, 15.09.1994, p. 201-206.

Research output: Contribution to journalArticle

TY - JOUR

T1 - The interaction kinetics and compound formation between electroless NiP and solder

AU - Lee, Chwan Ying

AU - Lin, Kwang-Lung

PY - 1994/9/15

Y1 - 1994/9/15

N2 - The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.

AB - The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.

UR - http://www.scopus.com/inward/record.url?scp=0028494896&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028494896&partnerID=8YFLogxK

U2 - 10.1016/0040-6090(94)90761-7

DO - 10.1016/0040-6090(94)90761-7

M3 - Article

VL - 249

SP - 201

EP - 206

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 2

ER -