The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment

Kwang Lung Lin, Chun Jen Chen

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

The interactions between In-Sn solders and an electroless Ni-P deposit within the multilayer combinations comprised of In-Sn/electroless Ni-P/Al were investigated with the aid of heat treatments at various temperatures and durations. The main reaction product was identified with X-ray diffractometry (XRD) as In3Ni2 regardless of the In-contents of the In-Sn solders. The formation of this In3Ni2 compound occurred through the diffusion of Ni towards the In-Sn solder. The intermetallic compound layer achieved its maximum thickness within 100 h upon heat treatment at 60°C; the thickness of the compound layer did not increase upon extending heat treatment. Sn tended to dissolve in the In3Ni2 compound.

Original languageEnglish
Pages (from-to)397-401
Number of pages5
JournalJournal of Materials Science: Materials in Electronics
Volume7
Issue number6
DOIs
Publication statusPublished - 1996 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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