The interface microstructure on the reliability of flip-chip laser diode bonding

Chien Chih Liu, Yen Kuang Lin, Mau-phon Houng, Yeong-Her Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have successfully developed a fluxless bonding process to manufacture In-Au microjoint between laser diode and silicon substrate, and studied the interface properties and microstructure of In-Au layer. From XRD, SEM and EDX results indicate that AuIn2 is the main intermetallic phase, which plays an important role on the quality of joints. To study the thermal stability, the flip-chip assemblies were then tested by thermal shock and high temperature storage. From the thermal shock test, we can find that high bonding temperature will result in failure mode, such as the occurrence of cracks at the grain boundary. From thermal aging test, no brittle intermetallic phases and fractures were observed in the solder joints. Therefore, the bonding process has to be optimized because the reliability of solder joint strongly depended on the initial microstructure. The optimal bonding temperature is 200°C after thermal shock test and high temperature storage test.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages438-444
Number of pages7
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Liu, C. C., Lin, Y. K., Houng, M., & Wang, Y-H. (2002). The interface microstructure on the reliability of flip-chip laser diode bonding. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 438-444). [1188879] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188879