The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

Chien Cheng Pan, Kwang-Lung Lin

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu5Zn8 were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.

Original languageEnglish
Article number103513
JournalJournal of Applied Physics
Volume109
Issue number10
DOIs
Publication statusPublished - 2011 May 15

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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