The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Fu Jung Yeh, Tsung Chieh Chiu, Kwang-Lung Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.

Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 2012
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
Duration: 2012 Dec 132012 Dec 16

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
CountryHong Kong
CityLantau Island
Period12-12-1312-12-16

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

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