The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Fu Jung Yeh; Tsung Chieh Chiu; Kwang-Lung Lin

doi:10.1109/EMAP.2012.6507860

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Fu Jung Yeh, Tsung Chieh Chiu, Kwang-Lung Lin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.

Original language	English
Title of host publication	14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs	https://doi.org/10.1109/EMAP.2012.6507860
Publication status	Published - 2012
Event	14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong Duration: 2012 Dec 13 → 2012 Dec 16

Other

Other	14th International Conference on Electronic Materials and Packaging, EMAP 2012
Country/Territory	Hong Kong
City	Lantau Island
Period	12-12-13 → 12-12-16

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials

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10.1109/EMAP.2012.6507860

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title = "The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test",

abstract = "The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.",

author = "Yeh, {Fu Jung} and Chiu, {Tsung Chieh} and Kwang-Lung Lin",

year = "2012",

doi = "10.1109/EMAP.2012.6507860",

language = "English",

isbn = "9781467349444",

booktitle = "14th International Conference on Electronic Materials and Packaging, EMAP 2012",

note = "14th International Conference on Electronic Materials and Packaging, EMAP 2012 ; Conference date: 13-12-2012 Through 16-12-2012",

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T1 - The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

AU - Yeh, Fu Jung

AU - Chiu, Tsung Chieh

AU - Lin, Kwang-Lung

PY - 2012

Y1 - 2012

N2 - The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.

AB - The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.

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U2 - 10.1109/EMAP.2012.6507860

DO - 10.1109/EMAP.2012.6507860

M3 - Conference contribution

AN - SCOPUS:84880255914

SN - 9781467349444

BT - 14th International Conference on Electronic Materials and Packaging, EMAP 2012

T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012

Y2 - 13 December 2012 through 16 December 2012

ER -

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

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