Abstract
The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.
Original language | English |
---|---|
Title of host publication | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 |
DOIs | |
Publication status | Published - 2012 |
Event | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong Duration: 2012 Dec 13 → 2012 Dec 16 |
Other
Other | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 |
---|---|
Country/Territory | Hong Kong |
City | Lantau Island |
Period | 12-12-13 → 12-12-16 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials