The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates

Chiang Ming Chuang; Hui Tzu Hung; Pei Chi Liu; Kwang Lung Lin

doi:10.1007/s11664-004-0287-3

The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates

Chiang Ming Chuang, Hui Tzu Hung, Pei Chi Liu, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

Original language	English
Pages (from-to)	7-13
Number of pages	7
Journal	Journal of Electronic Materials
Volume	33
Issue number	1
DOIs	https://doi.org/10.1007/s11664-004-0287-3
Publication status	Published - 2004 Jan 2

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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title = "The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates",

abstract = "The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.",

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AB - The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

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