The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates

Chiang Ming Chuang, Hui Tzu Hung, Pei Chi Liu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

Original languageEnglish
Pages (from-to)7-13
Number of pages7
JournalJournal of Electronic Materials
Issue number1
Publication statusPublished - 2004 Jan 2

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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