The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Wei Hsiang Huang; Kwang Lung Lin; Yu Wei Lin; Yun Kai Cheng

doi:10.1007/s11664-016-5044-x

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Wei Hsiang Huang, Kwang Lung Lin, Yu Wei Lin, Yun Kai Cheng

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0–6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)₂Al and (Ag, Pd)₃Al₂ for a Ag6Pd wire bond, while (Ag, Pd)₂Al and (Ag, Pd)₃Al₂ are mixed for the other Ag(1–4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag–Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)₃Al formed at the AgxPd/Al interface.

Original language	English
Pages (from-to)	6130-6136
Number of pages	7
Journal	Journal of Electronic Materials
Volume	45
Issue number	12
DOIs	https://doi.org/10.1007/s11664-016-5044-x
Publication status	Published - 2016 Dec 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-016-5044-x

Cite this

@article{35505e583eb34b999b162830bb88aaf6,

title = "The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire",

abstract = "Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0–6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)2Al and (Ag, Pd)3Al2 for a Ag6Pd wire bond, while (Ag, Pd)2Al and (Ag, Pd)3Al2 are mixed for the other Ag(1–4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag–Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)3Al formed at the AgxPd/Al interface.",

author = "Huang, {Wei Hsiang} and Lin, {Kwang Lung} and Lin, {Yu Wei} and Cheng, {Yun Kai}",

note = "Publisher Copyright: {\textcopyright} 2016, The Minerals, Metals & Materials Society.",

year = "2016",

month = dec,

day = "1",

doi = "10.1007/s11664-016-5044-x",

language = "English",

volume = "45",

pages = "6130--6136",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "12",

}

TY - JOUR

T1 - The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

AU - Huang, Wei Hsiang

AU - Lin, Kwang Lung

AU - Lin, Yu Wei

AU - Cheng, Yun Kai

PY - 2016/12/1

Y1 - 2016/12/1

N2 - Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0–6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)2Al and (Ag, Pd)3Al2 for a Ag6Pd wire bond, while (Ag, Pd)2Al and (Ag, Pd)3Al2 are mixed for the other Ag(1–4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag–Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)3Al formed at the AgxPd/Al interface.

AB - Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0–6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)2Al and (Ag, Pd)3Al2 for a Ag6Pd wire bond, while (Ag, Pd)2Al and (Ag, Pd)3Al2 are mixed for the other Ag(1–4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag–Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)3Al formed at the AgxPd/Al interface.

UR - http://www.scopus.com/inward/record.url?scp=84994330758&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84994330758&partnerID=8YFLogxK

U2 - 10.1007/s11664-016-5044-x

DO - 10.1007/s11664-016-5044-x

M3 - Article

AN - SCOPUS:84994330758

SN - 0361-5235

VL - 45

SP - 6130

EP - 6136

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 12

ER -

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this