The International Magnetics Conference (INTERMAG) 2023 Preface

Felipe Bohn; Min Fu Hsieh; Kyung Jin Lee; Chris Rea; Aurelie Spiesser; Petru Andrei

doi:10.1109/INTERMAG50591.2023.10265071

The International Magnetics Conference (INTERMAG) 2023 Preface

Felipe Bohn, Min Fu Hsieh, Kyung Jin Lee, Chris Rea, Aurelie Spiesser, Petru Andrei

Department of Electrical Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Journal	Digests of the Intermag Conference
Volume	2023-May
DOIs	https://doi.org/10.1109/INTERMAG50591.2023.10265071
Publication status	Published - 2023
Event	2023 IEEE International Magnetic Conference, INTERMAG 2023 - Sendai, Japan Duration: 2023 May 15 → 2023 May 19

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films

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10.1109/INTERMAG50591.2023.10265071

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title = "The International Magnetics Conference (INTERMAG) 2023 Preface",

author = "Felipe Bohn and Hsieh, {Min Fu} and Lee, {Kyung Jin} and Chris Rea and Aurelie Spiesser and Petru Andrei",

year = "2023",

doi = "10.1109/INTERMAG50591.2023.10265071",

language = "English",

volume = "2023-May",

journal = "Digests of the Intermag Conference",

issn = "0074-6843",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2023 IEEE International Magnetic Conference, INTERMAG 2023 ; Conference date: 15-05-2023 Through 19-05-2023",

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T1 - The International Magnetics Conference (INTERMAG) 2023 Preface

AU - Bohn, Felipe

AU - Hsieh, Min Fu

AU - Lee, Kyung Jin

AU - Rea, Chris

AU - Spiesser, Aurelie

AU - Andrei, Petru

PY - 2023

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AN - SCOPUS:85174505225

SN - 0074-6843

VL - 2023-May

JO - Digests of the Intermag Conference

JF - Digests of the Intermag Conference

T2 - 2023 IEEE International Magnetic Conference, INTERMAG 2023

Y2 - 15 May 2023 through 19 May 2023

ER -

The International Magnetics Conference (INTERMAG) 2023 Preface

All Science Journal Classification (ASJC) codes

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