The introduction of MEMS packaging technology

C. T. Hsieh, Jyh-Ming Ting, C. Yang, Chen-Kuei Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major tendency of the products because they consist the above characters. Involving the electronics, optoelectronics, information, mechanics, materials, biochemistry and control technologies, the MEMS techniques is the most potential science and will have great influence on human life in the twenty first century. The packaging technique is the key point in the MEMS devices, so it is necessary to study the techniques and the materials for the MEMS packing. In this study, the MEMS packaging techniques, including the packaging types and functions would be introduced.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages300-306
Number of pages7
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

Fingerprint

MEMS
Packaging
Biochemistry
Consumer electronics
Modems
Optoelectronic devices
Mechanics
Electronic equipment
Specifications

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Hsieh, C. T., Ting, J-M., Yang, C., & Chung, C-K. (2002). The introduction of MEMS packaging technology. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 300-306). [1188855] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188855
Hsieh, C. T. ; Ting, Jyh-Ming ; Yang, C. ; Chung, Chen-Kuei. / The introduction of MEMS packaging technology. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 300-306 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
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Hsieh, CT, Ting, J-M, Yang, C & Chung, C-K 2002, The introduction of MEMS packaging technology. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188855, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 300-306, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188855

The introduction of MEMS packaging technology. / Hsieh, C. T.; Ting, Jyh-Ming; Yang, C.; Chung, Chen-Kuei.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 300-306 1188855 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hsieh CT, Ting J-M, Yang C, Chung C-K. The introduction of MEMS packaging technology. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 300-306. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188855