The investigation of buckling, deformation and interaction of elastic films for touch panel applications

Chang Hsin Chuang, Kuo-Shen Chen, Chun Chic Chen, Ron Can Hong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thin ITO-based PET conductive membranes are the major sensing structure in resistive touch panels for network phones or other applications. However, device failures or malfunctions such as early touch and disagreement between force-applied and touched locations have been reported. By examining the surface profiles, it was found that these membranes have considerable initial out of plane deformation. This could be a sign of membrane buckling since the clamped design could causing additional in-plane compression which could triggering the structural buckling. It is important to analyze the buckling behavior of ITO/PET membranes due to initial imperfection, residual stress, or assembly issues, for developing engineering solutions for quality assurance. In this work, both finite element analyses and essential experimental characterizations are performed as the first step toward solving this problem. In conjunction with our previous study [1], this work mainly focuses on the buckling behavior by considering the effect of the compliance of double side glues and the associated post-buckling behavior. In parallel, several experimental investigations have been conducted for characterizing material properties of the adhesion tapes and the panel surface profile for supporting the buckling and post buckling analyses. By both simulation and experimental investigations, the major control factor for causing malfunction of touch panel could be identified and the corresponding engineering solutions would be developed for enhancing the device reliabilities.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages105-108
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - 2015 Feb 24
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
Duration: 2014 Oct 222014 Oct 24

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan
CityTaipei
Period14-10-2214-10-24

Fingerprint

Buckling
Membranes
Glues
Quality assurance
Tapes
Residual stresses
Materials properties
Adhesion
Defects

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Chuang, C. H., Chen, K-S., Chen, C. C., & Hong, R. C. (2015). The investigation of buckling, deformation and interaction of elastic films for touch panel applications. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (pp. 105-108). [7048398] (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048398
Chuang, Chang Hsin ; Chen, Kuo-Shen ; Chen, Chun Chic ; Hong, Ron Can. / The investigation of buckling, deformation and interaction of elastic films for touch panel applications. 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 105-108 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).
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Chuang, CH, Chen, K-S, Chen, CC & Hong, RC 2015, The investigation of buckling, deformation and interaction of elastic films for touch panel applications. in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings., 7048398, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 105-108, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014, Taipei, Taiwan, 14-10-22. https://doi.org/10.1109/IMPACT.2014.7048398

The investigation of buckling, deformation and interaction of elastic films for touch panel applications. / Chuang, Chang Hsin; Chen, Kuo-Shen; Chen, Chun Chic; Hong, Ron Can.

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. p. 105-108 7048398 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chuang CH, Chen K-S, Chen CC, Hong RC. The investigation of buckling, deformation and interaction of elastic films for touch panel applications. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. p. 105-108. 7048398. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). https://doi.org/10.1109/IMPACT.2014.7048398