The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Yao Ling Kuo, Kwang-Lung Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni 5Zn 21 and NiZn 3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.

Original languageEnglish
Title of host publicationAPM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
Pages193-198
Number of pages6
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China
Duration: 2011 Oct 252011 Oct 28

Publication series

NameProceedings - International Symposium on Advanced Packaging Materials
ISSN (Print)1550-5723

Other

Other2011 International Symposium on Advanced Packaging Materials, APM 2011
CountryChina
CityXiamen
Period11-10-2511-10-28

Fingerprint

Nickel plating
Soldering alloys
Eutectics
Kinetics
Temperature
Surface chemistry
Intermetallics
Solid solutions
Activation energy
Liquids

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Kuo, Y. L., & Lin, K-L. (2011). The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. In APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials (pp. 193-198). [6105698] (Proceedings - International Symposium on Advanced Packaging Materials). https://doi.org/10.1109/ISAPM.2011.6105698
Kuo, Yao Ling ; Lin, Kwang-Lung. / The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. 2011. pp. 193-198 (Proceedings - International Symposium on Advanced Packaging Materials).
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Kuo, YL & Lin, K-L 2011, The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. in APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials., 6105698, Proceedings - International Symposium on Advanced Packaging Materials, pp. 193-198, 2011 International Symposium on Advanced Packaging Materials, APM 2011, Xiamen, China, 11-10-25. https://doi.org/10.1109/ISAPM.2011.6105698

The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. / Kuo, Yao Ling; Lin, Kwang-Lung.

APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. 2011. p. 193-198 6105698 (Proceedings - International Symposium on Advanced Packaging Materials).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni 5Zn 21 and NiZn 3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.

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Kuo YL, Lin K-L. The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. In APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. 2011. p. 193-198. 6105698. (Proceedings - International Symposium on Advanced Packaging Materials). https://doi.org/10.1109/ISAPM.2011.6105698