The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The wettability of the solders Zn-25Sn-XAl (x=0-0.09wt%) was investigated by dipping method. The interfaces between solders and Cu substrate were investigated by scanning electron microscopy (SEM), electron probe microanalysis (EPMA) and energy dispersive spectroscopy (EDS) equipped in transmission elctron microscopy (TEM). It was found that the addtion of Al enhances the wettability of the solders on Cu. The three layers (Cu,Al)Zn, (Cu,Al)5Zn8 and (Cu,Al)Zn5 were found at the interfaces between Cu substrate and solders. The thickness of intermetallic compounds layers increased with Al additions. The higher Al addition, the higher Al intetnsity was detected in the intermetallic compounds layer. The Al addition exhibits two stages behaivor on both wetting time and interfacial intermetallic growth.

Original languageEnglish
Title of host publication18th International Conference on Electronic Packaging Technology, ICEPT 2017
EditorsChenxi Wang, Yanhong Tian, Tianchun Ye
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages80-88
Number of pages9
ISBN (Electronic)9781538629727
DOIs
Publication statusPublished - 2017 Sep 19
Event18th International Conference on Electronic Packaging Technology, ICEPT 2017 - Harbin, China
Duration: 2017 Aug 162017 Aug 19

Publication series

Name18th International Conference on Electronic Packaging Technology, ICEPT 2017

Other

Other18th International Conference on Electronic Packaging Technology, ICEPT 2017
CountryChina
CityHarbin
Period17-08-1617-08-19

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Polymers and Plastics
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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