Abstract
The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn-1Ag-0.1Cu-0.02Ni-0.05In, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.
| Original language | English |
|---|---|
| Pages (from-to) | 1057-1063 |
| Number of pages | 7 |
| Journal | Journal of Materials Research |
| Volume | 23 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2008 Apr 1 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering