The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints

T. S. Wang, S. C. Liu, Y. L. Huang, Kwang-Lung Lin, Y. S. Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn 5. Fractographies show that all of Sn37Pb solder joints exhibit the ductile fracture mode in both tests. On the other hand, Sn-3Ag-0.5Cu solder joints exhibit the interfacial fracture mode. The characteristic curve in both tests could demonstrate the failure feature. The ductile fracture behavior exhibits a long displacement and high fracture energy in both tests. The interfacial fracture behavior exhibits a short range displacement and low fracture energy during the test.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages293-296
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K-L., & Lai, Y. S. (2008). The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 293-296). [4784286] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784286