TY - GEN
T1 - The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints
AU - Wang, T. S.
AU - Liu, S. C.
AU - Huang, Y. L.
AU - Lin, K. L.
AU - Lai, Y. S.
PY - 2008
Y1 - 2008
N2 - Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn 5. Fractographies show that all of Sn37Pb solder joints exhibit the ductile fracture mode in both tests. On the other hand, Sn-3Ag-0.5Cu solder joints exhibit the interfacial fracture mode. The characteristic curve in both tests could demonstrate the failure feature. The ductile fracture behavior exhibits a long displacement and high fracture energy in both tests. The interfacial fracture behavior exhibits a short range displacement and low fracture energy during the test.
AB - Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn 5. Fractographies show that all of Sn37Pb solder joints exhibit the ductile fracture mode in both tests. On the other hand, Sn-3Ag-0.5Cu solder joints exhibit the interfacial fracture mode. The characteristic curve in both tests could demonstrate the failure feature. The ductile fracture behavior exhibits a long displacement and high fracture energy in both tests. The interfacial fracture behavior exhibits a short range displacement and low fracture energy during the test.
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U2 - 10.1109/EMAP.2008.4784286
DO - 10.1109/EMAP.2008.4784286
M3 - Conference contribution
AN - SCOPUS:64049117750
SN - 9781424436217
T3 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
SP - 293
EP - 296
BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
T2 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Y2 - 22 October 2008 through 24 October 2008
ER -