@inproceedings{6f8123c6d9b94f868d9042cb9f1874a3,
title = "The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints",
abstract = "Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn 5. Fractographies show that all of Sn37Pb solder joints exhibit the ductile fracture mode in both tests. On the other hand, Sn-3Ag-0.5Cu solder joints exhibit the interfacial fracture mode. The characteristic curve in both tests could demonstrate the failure feature. The ductile fracture behavior exhibits a long displacement and high fracture energy in both tests. The interfacial fracture behavior exhibits a short range displacement and low fracture energy during the test.",
author = "Wang, \{T. S.\} and Liu, \{S. C.\} and Huang, \{Y. L.\} and Lin, \{K. L.\} and Lai, \{Y. S.\}",
year = "2008",
doi = "10.1109/EMAP.2008.4784286",
language = "English",
isbn = "9781424436217",
series = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",
pages = "293--296",
booktitle = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",
note = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 ; Conference date: 22-10-2008 Through 24-10-2008",
}