TY - JOUR
T1 - The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09 wt%) high temperature lead free solder
AU - Niu, Xi
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors are grateful for the financial support provided for this study from the Ministry of Science and Technology of the Republic of China under NSC104-2221-E-006-029-MY3 .
Publisher Copyright:
© 2016 Elsevier B.V.
PY - 2016/11/20
Y1 - 2016/11/20
N2 - The microstructure and mechanical properties of Zn-25Sn-XAl ( X=0, 0.01, 0.03, 0.05, 0.09 wt% ) high temperature Pb-free solders were investigated. The addition of Al tends to refine the grain size and depress the undercooling behavior of the solder. The needle-like zinc-rich phase of the eutectic region was coarsened upon Al addition. The increasing addition of Al up to 0.09 wt% enhanced the ultimate tensile strength (UTS) of the alloy from 67.28 to 78.61 MPa (16.84% improved), and the yield strength from 42.52 to 52.81 MPa (24.2% improved). The strain of the solder degraded from 39.02–32.83% when the addition of Al ranged from 0 to 0.09 wt%.
AB - The microstructure and mechanical properties of Zn-25Sn-XAl ( X=0, 0.01, 0.03, 0.05, 0.09 wt% ) high temperature Pb-free solders were investigated. The addition of Al tends to refine the grain size and depress the undercooling behavior of the solder. The needle-like zinc-rich phase of the eutectic region was coarsened upon Al addition. The increasing addition of Al up to 0.09 wt% enhanced the ultimate tensile strength (UTS) of the alloy from 67.28 to 78.61 MPa (16.84% improved), and the yield strength from 42.52 to 52.81 MPa (24.2% improved). The strain of the solder degraded from 39.02–32.83% when the addition of Al ranged from 0 to 0.09 wt%.
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U2 - 10.1016/j.msea.2016.09.061
DO - 10.1016/j.msea.2016.09.061
M3 - Article
AN - SCOPUS:84988596332
SN - 0921-5093
VL - 677
SP - 384
EP - 392
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
ER -