The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys-the effect of Ga

Kang I. Chen, Kwang Lung Lin

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

The microstructures and mechanical properties of Sn-8.55Zn-0.5Ag-0.45Al-yGa (wt.%) lead-free solders were investigated. The y content of the solders investigated was 0.5-3.0 wt.%. The results indicate that Ga exhibits prominent influence in the microstructure as well as mechanical properties of the solders. By increasing Ga, the fraction of the Sn/Zn eutectic region decreases and the Sn-matrix region increases. An increase in the Ga content from 0.5 wt.% to 2.0 wt.% enhances the tensile strength while degrading the ductility. The mechanical properties and differential scanning calorimetry (DSC) behavior have been compared with that of the 63Sn-37Pb solder. Gallium lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater tensile strength and better ductility than the 63Sn-37Pb solder.

Original languageEnglish
Pages (from-to)1111-1116
Number of pages6
JournalJournal of Electronic Materials
Volume32
Issue number10
DOIs
Publication statusPublished - 2003 Oct

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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