The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ag

Kang I. Chen, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

41 Citations (Scopus)

Abstract

The microstructures and mechanical properties of Sn-8.55Zn-xAg-0.45 Al-0.5Ga (wt.%) lead-free solders were investigated. The x content of the solders investigated were 0.5-3.0 wt.%. The results indicate that Ag plays an important role not only in the structure but also in the mechanically properties. The mechanical properties and differential scanning calorimetry (DSC) behavior has been compared with that of 63Sn-37Pb solder. Small additions of Ag decreased the melting point of the Sn-8.55Zn-xAg-0.45Al-0.5Ga solders while maintaining the same strength and ductility as the 63Sn-37Pb solder.

Original languageEnglish
Pages (from-to)861-867
Number of pages7
JournalJournal of Electronic Materials
Volume31
Issue number8
DOIs
Publication statusPublished - 2002 Aug

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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