The microstructures of the Sn-Zn-Al solder alloys

Kwang Lung Lin; Li Hsiang Wen; Tzy Pin Liu

doi:10.1007/s11664-998-0197-x

The microstructures of the Sn-Zn-Al solder alloys

Kwang Lung Lin, Li Hsiang Wen, Tzy Pin Liu

Research output: Contribution to journal › Article › peer-review

75 Citations (Scopus)

Abstract

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

Original language	English
Pages (from-to)	97-105
Number of pages	9
Journal	Journal of Electronic Materials
Volume	27
Issue number	3
DOIs	https://doi.org/10.1007/s11664-998-0197-x
Publication status	Published - 1998 Mar

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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abstract = "The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.",

author = "Lin, {Kwang Lung} and Wen, {Li Hsiang} and Liu, {Tzy Pin}",

note = "Funding Information: The financial support of this work from the National Science Council of the Republic of China under NSC85-2216-E-006-031 is gratefully acknowledged.",

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AU - Lin, Kwang Lung

AU - Wen, Li Hsiang

AU - Liu, Tzy Pin

N1 - Funding Information: The financial support of this work from the National Science Council of the Republic of China under NSC85-2216-E-006-031 is gratefully acknowledged.

PY - 1998/3

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N2 - The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

AB - The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

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The microstructures of the Sn-Zn-Al solder alloys

Abstract

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