The microstructures of the Sn-Zn-Al solder alloys

Kwang Lung Lin, Li Hsiang Wen, Tzy Pin Liu

Research output: Contribution to journalArticlepeer-review

75 Citations (Scopus)

Abstract

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

Original languageEnglish
Pages (from-to)97-105
Number of pages9
JournalJournal of Electronic Materials
Volume27
Issue number3
DOIs
Publication statusPublished - 1998 Mar

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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