This study was an investigation of the effects of current density, chips' position and electrode area ratio on the microstructure and composition of the electroplated solder bumps on a silicon wafer. The current density and anode/cathode area ratio tended to refine the deposit microstructure. The chips' position and the anode/cathode area ratios did not show significant effect on the composition of the solder bumps at the applied current density of 30 mA/cm2. The effect of the electrode area ratio on the bumps' composition became prominent when electroplated at an applied current density of 70 mA/cm2. The deviation of the composition of the bumps is less than two percent of Sn content, regardless of the chips' position.
|Number of pages||4|
|Specialist publication||Plating and Surface Finishing|
|Publication status||Published - 1996 Jun 1|
All Science Journal Classification (ASJC) codes
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry