The morphologies and compositions of electroplated solder bumps on a silicon wafer

Kwang Lung Lin, Shiuh Yuan Chang

Research output: Contribution to specialist publicationArticle

2 Citations (Scopus)

Abstract

This study was an investigation of the effects of current density, chips' position and electrode area ratio on the microstructure and composition of the electroplated solder bumps on a silicon wafer. The current density and anode/cathode area ratio tended to refine the deposit microstructure. The chips' position and the anode/cathode area ratios did not show significant effect on the composition of the solder bumps at the applied current density of 30 mA/cm2. The effect of the electrode area ratio on the bumps' composition became prominent when electroplated at an applied current density of 70 mA/cm2. The deviation of the composition of the bumps is less than two percent of Sn content, regardless of the chips' position.

Original languageEnglish
Pages58-61
Number of pages4
Volume83
No.6
Specialist publicationPlating and Surface Finishing
Publication statusPublished - 1996 Jun 1

All Science Journal Classification (ASJC) codes

  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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