The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

Shiqi Zhou, Chih han Yang, Yu An Shen, Shih kang Lin, Hiroshi Nishikawa

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A new Sn-45Bi-2.6Zn (wt%) alloy was developed to replace the eutectic Sn-58Bi alloy as a low-melting point solder alloy. A 112% increase in the tensile elongation (0.68 vs. 0.32 in strain) was obtained by increasing the Sn-to-Bi volume ratio by reducing the volume content of brittle Bi. A solidus temperature of 133 °C was calculated from the Sn–Bi–Zn ternary system. The calculation of phase diagram (CALPHAD) method was performed to help understand the melting behavior of Sn-45Bi-2.6Zn alloy.

Original languageEnglish
Article number100300
JournalMaterialia
Volume6
DOIs
Publication statusPublished - 2019 Jun

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

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