The optimal design of the thermal spreading on high power LEDs

Jui Ching Hsieh, David T.W. Lin, Chin-Hsiang Cheng, Siwapong Kingkaew, Sheng Chung Chen

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

New energy and energy saving are the two basic energy issues. This study proposes an innovative optimal method to design LEDs with high thermal spreading holder. The optimization uses the FEM combined with the simplified conjugated gradient method (SCGM). The minimal temperature of the MCPCB backside of the LEDs is obtained throughout this design. The simulations have been proofed by the experiment of IR and thermal couple measurement. The optimal temperature decreases at about 4 °C compared with the original temperature without any active cooling device. This design can prolong the LEDs' life to benefit the energy saving obviously. In addition, this design combined with the active cooling device will achieve better heat dissipation on cooling of the electronic component.

Original languageEnglish
Pages (from-to)904-909
Number of pages6
JournalMicroelectronics Journal
Volume45
Issue number7
DOIs
Publication statusPublished - 2014 Jan 1

Fingerprint

Light emitting diodes
light emitting diodes
cooling
Cooling
Energy conservation
Gradient methods
energy
holders
Heat losses
Temperature
temperature
Finite element method
gradients
optimization
Optimal design
Hot Temperature
electronics
simulation
Experiments

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Hsieh, Jui Ching ; Lin, David T.W. ; Cheng, Chin-Hsiang ; Kingkaew, Siwapong ; Chen, Sheng Chung. / The optimal design of the thermal spreading on high power LEDs. In: Microelectronics Journal. 2014 ; Vol. 45, No. 7. pp. 904-909.
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The optimal design of the thermal spreading on high power LEDs. / Hsieh, Jui Ching; Lin, David T.W.; Cheng, Chin-Hsiang; Kingkaew, Siwapong; Chen, Sheng Chung.

In: Microelectronics Journal, Vol. 45, No. 7, 01.01.2014, p. 904-909.

Research output: Contribution to journalArticle

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