The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu Wei Lin; Ren You Wang; Wun Bin Ke; I. Sheng Wang; Ying Ta Chiu; Kuo Chang Lu; Kwang Lung Lin; Yi Shao Lai

doi:10.1016/j.msea.2012.02.063

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu Wei Lin, Ren You Wang, Wun Bin Ke, I. Sheng Wang, Ying Ta Chiu, Kuo Chang Lu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

Abstract

The Pd plating on the 20. μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15. ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

Original language	English
Pages (from-to)	152-157
Number of pages	6
Journal	Materials Science and Engineering: A
Volume	543
DOIs	https://doi.org/10.1016/j.msea.2012.02.063
Publication status	Published - 2012 May 1

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.msea.2012.02.063

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@article{dc472bd0150a435784abaa57faefdad6,

title = "The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation",

abstract = "The Pd plating on the 20. μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15. ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.",

author = "Lin, {Yu Wei} and Wang, {Ren You} and Ke, {Wun Bin} and Wang, {I. Sheng} and Chiu, {Ying Ta} and Lu, {Kuo Chang} and Lin, {Kwang Lung} and Lai, {Yi Shao}",

note = "Funding Information: K.C.L. and K.L.L. acknowledge the support by National Science Council through grants 99-2221-E-006-131 , 100-2628-E-006-025-MY2 and 98-2221-E-006-065-MY3 .",

year = "2012",

month = may,

day = "1",

doi = "10.1016/j.msea.2012.02.063",

language = "English",

volume = "543",

pages = "152--157",

journal = "Materials Science and Engineering: A",

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T1 - The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

AU - Lin, Yu Wei

AU - Wang, Ren You

AU - Ke, Wun Bin

AU - Wang, I. Sheng

AU - Chiu, Ying Ta

AU - Lu, Kuo Chang

AU - Lin, Kwang Lung

AU - Lai, Yi Shao

N1 - Funding Information: K.C.L. and K.L.L. acknowledge the support by National Science Council through grants 99-2221-E-006-131 , 100-2628-E-006-025-MY2 and 98-2221-E-006-065-MY3 .

PY - 2012/5/1

Y1 - 2012/5/1

N2 - The Pd plating on the 20. μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15. ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

AB - The Pd plating on the 20. μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15. ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

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JO - Materials Science and Engineering: A

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The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

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All Science Journal Classification (ASJC) codes

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