The performance and fracture mechanism of solder joints under mechanical reliability test

Wei Luen Jang, Tai Siang Wang, Yen Fen Lai, Kwang-Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The drop resistance and fracture behavior of Sn-37Pb, Sn-3.0Ag-0.5Cu (SAC305), Sn-1.0Ag-0.5Cu (SAC105), and Sn-8.5Zn-0.5Ag-0.01Al-0.1 Ga (SnZn-5e) solder ball joints under the board-level drop test (BLDT) and the ball impact test (BIT) were studied. The results show that the drop reliabilities in terms of the characteristic life ratio from the Weibul plot are SnZn-5e: Sn-37Pb:SAC105:SAC305 = 3.1:2.9:2.1:1. It was observed that failure of Sn-37Pb occurred at the eutectic tin-lead phase whereas it took place at the brittle interface between the (Cu,Ni) 6Sn 5 inter-metallic compound and Ni layer in SAC305. The failure of SAC105 was found to be located within the solder matrix as well as at the interface of the inter-metallic compound. The failure of SnZn-5e depends on the morphology of the interfacial inter-metallic compound. The failure modes of Sn-37Pb and SAC305 after the BIT were similar to those after the BLDT. The maximum impact force (F max) and the initial fracture energy (E) from the BIT can be used to evaluate the drop reliability of solder joints.

Original languageEnglish
Pages (from-to)1428-1434
Number of pages7
JournalMicroelectronics Reliability
Volume52
Issue number7
DOIs
Publication statusPublished - 2012 Jul 1

Fingerprint

Metallic compounds
solders
impact tests
Soldering alloys
balls
drop tests
Fracture energy
Tin
Eutectics
Failure modes
failure modes
Lead
eutectics
tin
plots
matrices
energy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Jang, Wei Luen ; Wang, Tai Siang ; Lai, Yen Fen ; Lin, Kwang-Lung ; Lai, Yi Shao. / The performance and fracture mechanism of solder joints under mechanical reliability test. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 7. pp. 1428-1434.
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The performance and fracture mechanism of solder joints under mechanical reliability test. / Jang, Wei Luen; Wang, Tai Siang; Lai, Yen Fen; Lin, Kwang-Lung; Lai, Yi Shao.

In: Microelectronics Reliability, Vol. 52, No. 7, 01.07.2012, p. 1428-1434.

Research output: Contribution to journalArticle

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AU - Lai, Yen Fen

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