The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Han Wen Lin; Jia Ling Lu; Chen Min Liu; Chih Chen; King Ning Tu; Delphic Chen; Jui Chao Kuo

doi:10.1109/IMPACT.2012.6420285

The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads

Han Wen Lin, Jia Ling Lu, Chen Min Liu, Chih Chen, King Ning Tu, Delphic Chen, Jui Chao Kuo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu₆Sn₅s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu₆Sn₅ were preferred at (0001). As the time of reflow extended, the orientations of Cu ₆Sn₅ would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu₆Sn₅. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

Original language	English
Title of host publication	2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
Pages	90-93
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2012.6420285
Publication status	Published - 2012
Event	2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan Duration: 2012 Oct 24 → 2012 Oct 26

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Other

Other	2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
Country/Territory	Taiwan
City	Taipei
Period	12-10-24 → 12-10-26

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/IMPACT.2012.6420285

Cite this

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D., & Kuo, J. C. (2012). The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads. In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings (pp. 90-93). Article 6420285 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2012.6420285

Lin, Han Wen ; Lu, Jia Ling ; Liu, Chen Min et al. / The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads. 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. pp. 90-93 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

@inproceedings{310fee61749e400e852074c40e19c3b6,

title = "The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads",

abstract = "The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.",

author = "Lin, {Han Wen} and Lu, {Jia Ling} and Liu, {Chen Min} and Chih Chen and Tu, {King Ning} and Delphic Chen and Kuo, {Jui Chao}",

year = "2012",

doi = "10.1109/IMPACT.2012.6420285",

language = "English",

isbn = "9781467316385",

series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

pages = "90--93",

booktitle = "2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings",

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}

Lin, HW, Lu, JL, Liu, CM, Chen, C, Tu, KN, Chen, D & Kuo, JC 2012, The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads. in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings., 6420285, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, pp. 90-93, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012, Taipei, Taiwan, 12-10-24. https://doi.org/10.1109/IMPACT.2012.6420285

The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads. / Lin, Han Wen; Lu, Jia Ling; Liu, Chen Min et al.
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. p. 90-93 6420285 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Lu, Jia Ling

AU - Liu, Chen Min

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AU - Chen, Delphic

AU - Kuo, Jui Chao

PY - 2012

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N2 - The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

AB - The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

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BT - 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings

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ER -

Lin HW, Lu JL, Liu CM, Chen C, Tu KN, Chen D et al. The preferential growth of η-Cu₆Sn₅ on (111) uni-directional Cu pads. In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. p. 90-93. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2012.6420285