The recrystallization of microelectronic lead-free solders

Fei Yi Hung; Truan Sheng Lui; Li Hui Chen; Zhi Feng Gu

doi:10.2320/matertrans.MRA2008048

The recrystallization of microelectronic lead-free solders

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Zhi Feng Gu

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

In Sn-2 mass%Ag-0.5 mass%Cu solder alloy, recrystallization was induced by thermal cycles and the homogenized effect of thermal aging promoted the vibration resistance. Due to the inner stress induced by thermal cycles, the thermal cycle specimen not only possessed a finer structure but also a large number of grain boundaries that were able to increase the vibration life. During vibration, dynamic recrystallization (DRX) was able to occur. In addition. DRX and grain growth had an obvious tendency to increase as the tensile strain rate was increased in the Sn-1 mass%Ag-0.5 mass%Cu solder alloy with a high β-Sn content. Also, high temperatures and plastic deformation had a significant influence on the recrystallization ot the solders.

Original language	English
Pages (from-to)	2298-2302
Number of pages	5
Journal	Materials Transactions
Volume	49
Issue number	10
DOIs	https://doi.org/10.2320/matertrans.MRA2008048
Publication status	Published - 2008 Oct

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.2320/matertrans.MRA2008048

Cite this

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title = "The recrystallization of microelectronic lead-free solders",

abstract = "In Sn-2 mass%Ag-0.5 mass%Cu solder alloy, recrystallization was induced by thermal cycles and the homogenized effect of thermal aging promoted the vibration resistance. Due to the inner stress induced by thermal cycles, the thermal cycle specimen not only possessed a finer structure but also a large number of grain boundaries that were able to increase the vibration life. During vibration, dynamic recrystallization (DRX) was able to occur. In addition. DRX and grain growth had an obvious tendency to increase as the tensile strain rate was increased in the Sn-1 mass%Ag-0.5 mass%Cu solder alloy with a high β-Sn content. Also, high temperatures and plastic deformation had a significant influence on the recrystallization ot the solders.",

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AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Gu, Zhi Feng

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AB - In Sn-2 mass%Ag-0.5 mass%Cu solder alloy, recrystallization was induced by thermal cycles and the homogenized effect of thermal aging promoted the vibration resistance. Due to the inner stress induced by thermal cycles, the thermal cycle specimen not only possessed a finer structure but also a large number of grain boundaries that were able to increase the vibration life. During vibration, dynamic recrystallization (DRX) was able to occur. In addition. DRX and grain growth had an obvious tendency to increase as the tensile strain rate was increased in the Sn-1 mass%Ag-0.5 mass%Cu solder alloy with a high β-Sn content. Also, high temperatures and plastic deformation had a significant influence on the recrystallization ot the solders.

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The recrystallization of microelectronic lead-free solders

Abstract

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