The striated deformation of Sn solders under high frequency resonant vibration

C. M. Chuang, T. S. Lui, L. H. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages328-334
Number of pages7
ISBN (Electronic)0780371577, 9780780371576
DOIs
Publication statusPublished - 2001 Jan 1
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001 Nov 192001 Nov 22

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
CountryKorea, Republic of
CityJeju Island
Period01-11-1901-11-22

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Chuang, C. M., Lui, T. S., & Chen, L. H. (2001). The striated deformation of Sn solders under high frequency resonant vibration. In S. B. Lee, & K. W. Paik (Eds.), Advances in Electronic Materials and Packaging 2001 (pp. 328-334). [984005] (Advances in Electronic Materials and Packaging 2001). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2001.984005