The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Shiqi Zhou, Chih Han Yang, Yu An Shen, Shih Kang Lin, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new Sn-45Bi-2.6Zn (wt. %) alloy was developed to replacing eutectic Sn-58Bi alloy as a low-melting temperature solder alloy. A tensile elongation improvement was obtained by increasing the Sn to Bi volume ratio because the content of intrinsic brittle Bi was reduced. A solidus temperature of 133 was achieved in a calculated Sn-Bi-Zn ternary system. The calculation of phase diagram (CALPHAD) method was used to help understand the melting behavior of Sn-45Bi-2.6Zn alloy. After aging, the elongation was still superior than that of eutectic Sn-58bi owing to the larger volume fraction of Sn phase.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages333-336
Number of pages4
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19-04-1719-04-20

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

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