The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Shiqi Zhou, Chih Han Yang, Yu An Shen, Shih-kang Lin, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new Sn-45Bi-2.6Zn (wt. %) alloy was developed to replacing eutectic Sn-58Bi alloy as a low-melting temperature solder alloy. A tensile elongation improvement was obtained by increasing the Sn to Bi volume ratio because the content of intrinsic brittle Bi was reduced. A solidus temperature of 133 was achieved in a calculated Sn-Bi-Zn ternary system. The calculation of phase diagram (CALPHAD) method was used to help understand the melting behavior of Sn-45Bi-2.6Zn alloy. After aging, the elongation was still superior than that of eutectic Sn-58bi owing to the larger volume fraction of Sn phase.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages333-336
Number of pages4
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19-04-1719-04-20

Fingerprint

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys
Phase diagrams
Melting point
Volume fraction
Melting
Aging of materials
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S., & Nishikawa, H. (2019). The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 333-336). [8733417] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733417
Zhou, Shiqi ; Yang, Chih Han ; Shen, Yu An ; Lin, Shih-kang ; Nishikawa, Hiroshi. / The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 333-336 (2019 International Conference on Electronics Packaging, ICEP 2019).
@inproceedings{bdc14bcdf9784241b17c70b65f3d7092,
title = "The study of Sn-45Bi-2.6Zn alloy before and after thermal aging",
abstract = "A new Sn-45Bi-2.6Zn (wt. {\%}) alloy was developed to replacing eutectic Sn-58Bi alloy as a low-melting temperature solder alloy. A tensile elongation improvement was obtained by increasing the Sn to Bi volume ratio because the content of intrinsic brittle Bi was reduced. A solidus temperature of 133 was achieved in a calculated Sn-Bi-Zn ternary system. The calculation of phase diagram (CALPHAD) method was used to help understand the melting behavior of Sn-45Bi-2.6Zn alloy. After aging, the elongation was still superior than that of eutectic Sn-58bi owing to the larger volume fraction of Sn phase.",
author = "Shiqi Zhou and Yang, {Chih Han} and Shen, {Yu An} and Shih-kang Lin and Hiroshi Nishikawa",
year = "2019",
month = "4",
day = "1",
doi = "10.23919/ICEP.2019.8733417",
language = "English",
series = "2019 International Conference on Electronics Packaging, ICEP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "333--336",
booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",
address = "United States",

}

Zhou, S, Yang, CH, Shen, YA, Lin, S & Nishikawa, H 2019, The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733417, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 333-336, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19-04-17. https://doi.org/10.23919/ICEP.2019.8733417

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. / Zhou, Shiqi; Yang, Chih Han; Shen, Yu An; Lin, Shih-kang; Nishikawa, Hiroshi.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 333-336 8733417 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

AU - Zhou, Shiqi

AU - Yang, Chih Han

AU - Shen, Yu An

AU - Lin, Shih-kang

AU - Nishikawa, Hiroshi

PY - 2019/4/1

Y1 - 2019/4/1

N2 - A new Sn-45Bi-2.6Zn (wt. %) alloy was developed to replacing eutectic Sn-58Bi alloy as a low-melting temperature solder alloy. A tensile elongation improvement was obtained by increasing the Sn to Bi volume ratio because the content of intrinsic brittle Bi was reduced. A solidus temperature of 133 was achieved in a calculated Sn-Bi-Zn ternary system. The calculation of phase diagram (CALPHAD) method was used to help understand the melting behavior of Sn-45Bi-2.6Zn alloy. After aging, the elongation was still superior than that of eutectic Sn-58bi owing to the larger volume fraction of Sn phase.

AB - A new Sn-45Bi-2.6Zn (wt. %) alloy was developed to replacing eutectic Sn-58Bi alloy as a low-melting temperature solder alloy. A tensile elongation improvement was obtained by increasing the Sn to Bi volume ratio because the content of intrinsic brittle Bi was reduced. A solidus temperature of 133 was achieved in a calculated Sn-Bi-Zn ternary system. The calculation of phase diagram (CALPHAD) method was used to help understand the melting behavior of Sn-45Bi-2.6Zn alloy. After aging, the elongation was still superior than that of eutectic Sn-58bi owing to the larger volume fraction of Sn phase.

UR - http://www.scopus.com/inward/record.url?scp=85068327040&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068327040&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2019.8733417

DO - 10.23919/ICEP.2019.8733417

M3 - Conference contribution

AN - SCOPUS:85068327040

T3 - 2019 International Conference on Electronics Packaging, ICEP 2019

SP - 333

EP - 336

BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Zhou S, Yang CH, Shen YA, Lin S, Nishikawa H. The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 333-336. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733417