The transmission characteristics of sound wave in power cable

Ju Chu Hsieh, Cheng Chi Tai, Ching Chau Su, Chien Yi Chen, Jiann Fuh Chen, Yu Hsun Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The cause of power electric cable fault is often source from the cable splice and cable terminator used in the electric cable connection and the partial discharge released from the improper construction process. It makes the insulation stuff aging and damaged. When the insulation capability becomes worse, it could cause unexpected damage on the high-voltage cables, many industry and research institutes have paid more and more attention on the maintenance of high voltage cables and diagnosis techniques of fault prediction. The acoustic emission method mentioned in this article is mainly on the characteristics analysis of basic measurement of sound delivery characteristics during the electric cable connection, the research on the original location of sound wave, and distribution attenuation.

Original languageEnglish
Title of host publicationProceedings of 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008
PublisherIEEE Computer Society
Pages1228-1231
Number of pages4
ISBN (Print)9781424416219
DOIs
Publication statusPublished - 2008 Jan 1
Event2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008 - Beijing, China
Duration: 2008 Apr 212008 Apr 24

Publication series

NameProceedings of 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008

Other

Other2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008
CountryChina
CityBeijing
Period08-04-2108-04-24

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Hsieh, J. C., Tai, C. C., Su, C. C., Chen, C. Y., Chen, J. F., & Lin, Y. H. (2008). The transmission characteristics of sound wave in power cable. In Proceedings of 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008 (pp. 1228-1231). [4580510] (Proceedings of 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008). IEEE Computer Society. https://doi.org/10.1109/CMD.2008.4580510