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The use of Mahalanobis-Taguchi System to improve flip-chip bumping height inspection efficiency
Taho Yang
, Yuan Ting Cheng
Institute of Manufacturing Information and Systems
Research output
:
Contribution to journal
›
Article
›
peer-review
30
Citations (Scopus)
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Dive into the research topics of 'The use of Mahalanobis-Taguchi System to improve flip-chip bumping height inspection efficiency'. Together they form a unique fingerprint.
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Physics & Astronomy
inspection
100%
chips
84%
packaging
11%
microelectronics
10%
industries
8%
wire
7%
products
6%
electronics
5%
Chemical Compounds
Microelectronics
60%
Industry
39%
Time
38%
Reduction
24%
Engineering & Materials Science
Inspection
81%
Electronics industry
13%
Microelectronics
11%
Packaging
9%
Wire
8%