The wetting of copper by Al-Zn-Sn solders

Kwang Lung Lin, Li Hsiang Wen

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)

Abstract

Copper wetting times were measured for various Al-Zn-Sn solders using a wetting balance. Wettability of Cu with the Al-Zn-Sn solders was enhanced by increasing the Al and Zn contents. A scanning electron microscope (SEM) investigation on the solidified wetting sample revealed that diffusion of Al and Zn towards Cu is responsible for the observed wetting behaviour. The dipping speed is also important.

Original languageEnglish
Pages (from-to)5-8
Number of pages4
JournalJournal of Materials Science: Materials in Electronics
Volume9
Issue number1
DOIs
Publication statusPublished - 1998

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'The wetting of copper by Al-Zn-Sn solders'. Together they form a unique fingerprint.

Cite this