Theoretical investigation for the material removal rate of metal polishing process

Yeau-Ren Jeng, P. Y. Huang, H. J. Tsai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The objective of this research is to better understand the mechanisms of material removal in the polishing process. This study is aimed to establish a material removal rate model for metal polishing to predict the result of metal polishing process. This research conducts theoretical study to investigate the material removal rate and its mechanism during the metal polishing process. The present study proposes a material removal rate model for metal polishing based upon a micro-contact model which considers the effects of the abrasive particles located between the polishing interfaces. In addition to such operational parameters as the applied down force, the present study also considers the consumable parameters rarely investigated by previous models, including workpiece surface hardness, abrasive particle size and the standard deviation of abrasive size distribution. The current results show that the material removal rate increases as the average abrasive particle size. In addition, the smaller standard deviation of abrasive particle size distribution can increase the efficiency of metal polishing process. This study also provides physical insights into the interfacial phenomena not discussed by previous models, which ignored the effects of abrasive particles between the polishing interfaces during force balancing.

Original languageEnglish
Title of host publicationProceedings of the 35th International MATADOR 2007 Conference
Pages207-210
Number of pages4
Publication statusPublished - 2007 Dec 1
Event35th International MATADOR 2007 Conference - Taipei, Taiwan
Duration: 2007 Jul 12007 Jul 1

Publication series

NameProceedings of the 35th International MATADOR 2007 Conference

Other

Other35th International MATADOR 2007 Conference
CountryTaiwan
CityTaipei
Period07-07-0107-07-01

Fingerprint

Polishing
Abrasives
Metals
Particle size
Particle size analysis
Hardness

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials

Cite this

Jeng, Y-R., Huang, P. Y., & Tsai, H. J. (2007). Theoretical investigation for the material removal rate of metal polishing process. In Proceedings of the 35th International MATADOR 2007 Conference (pp. 207-210). (Proceedings of the 35th International MATADOR 2007 Conference).
Jeng, Yeau-Ren ; Huang, P. Y. ; Tsai, H. J. / Theoretical investigation for the material removal rate of metal polishing process. Proceedings of the 35th International MATADOR 2007 Conference. 2007. pp. 207-210 (Proceedings of the 35th International MATADOR 2007 Conference).
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Jeng, Y-R, Huang, PY & Tsai, HJ 2007, Theoretical investigation for the material removal rate of metal polishing process. in Proceedings of the 35th International MATADOR 2007 Conference. Proceedings of the 35th International MATADOR 2007 Conference, pp. 207-210, 35th International MATADOR 2007 Conference, Taipei, Taiwan, 07-07-01.

Theoretical investigation for the material removal rate of metal polishing process. / Jeng, Yeau-Ren; Huang, P. Y.; Tsai, H. J.

Proceedings of the 35th International MATADOR 2007 Conference. 2007. p. 207-210 (Proceedings of the 35th International MATADOR 2007 Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Jeng Y-R, Huang PY, Tsai HJ. Theoretical investigation for the material removal rate of metal polishing process. In Proceedings of the 35th International MATADOR 2007 Conference. 2007. p. 207-210. (Proceedings of the 35th International MATADOR 2007 Conference).