TY - GEN
T1 - Theoretical modeling and experimental verification on imprinting mechanism of laser assisted direct imprinting (LADI)
AU - Lee, Yung Chun
AU - Ruan, Jun Yi
AU - Hsiao, Fei Bin
AU - Chen, Chun Ming
PY - 2008/1/1
Y1 - 2008/1/1
N2 - This paper discusses the theoretical modeling of laser assisted direct imprinting (LADI) which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct fabricating nanostructures on a silicon substrate. Based on pulsed laser heating, liquid film squeezing, and elastodynamic theories, a unified theory has successfully developed which not only quantitatively explains the fundamental mechanism of LADI but also can be used to predict correlations between the final imprinting depth and several important parameters including laser fluence, contact pressure, and feature size. To verify this theory, a series of LADI experiments have been carried out. Experimental results, in their general trends, are in agreement with the theoretical predictions and therefore supporting the validity of the modeling. Physical implications and potential applications of this modeling will be addressed.
AB - This paper discusses the theoretical modeling of laser assisted direct imprinting (LADI) which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct fabricating nanostructures on a silicon substrate. Based on pulsed laser heating, liquid film squeezing, and elastodynamic theories, a unified theory has successfully developed which not only quantitatively explains the fundamental mechanism of LADI but also can be used to predict correlations between the final imprinting depth and several important parameters including laser fluence, contact pressure, and feature size. To verify this theory, a series of LADI experiments have been carried out. Experimental results, in their general trends, are in agreement with the theoretical predictions and therefore supporting the validity of the modeling. Physical implications and potential applications of this modeling will be addressed.
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U2 - 10.1109/NEMS.2008.4484363
DO - 10.1109/NEMS.2008.4484363
M3 - Conference contribution
AN - SCOPUS:50249131497
SN - 9781424419081
T3 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
SP - 418
EP - 421
BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
PB - IEEE Computer Society
T2 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Y2 - 6 January 2008 through 9 January 2008
ER -