Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Tian Shiang Yang, Guang Di Chen, Kuo Shen Chen, Rong Can Hong, Tz Cheng Chiu, Chang Da Wen, Chun Han Li, Chien Jung Huang, Kun Tso Chen, Mao Chi Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Ultrathin glass is a promising substrate material for web processing (also called roll-to-roll processing) of flexible electronics, but is highly susceptible to breaking and cracking due to the almost inevitable presence of substrate-edge defects. Recently, a novel technique for removing the micro cracks on the edges of ultrathin glass substrates was devised at ITRI. It amounts to shining a CO2 laser on one edge of a substrate, which induces spontaneous peeling of a thin layer containing preexisting cracks on the edge from the substrate, resulting in an essentially crack-free new substrate edge. Exploiting the thinness of ultrathin glass substrates, here we propose a simplified two-dimensional thermal model for the laser peeling process, and obtain an analytic expression for the transient temperature variation in a substrate being peeled. This enables us to locate the "thermally affected zone" in the substrate, which turns out to be impressively similar in size and shape to the substrate-edge peels observed in experiments. Moreover, a quantitative criterion for the minimum cooling rate required for the progression of the peeling process is obtained. The results here thus provide useful insights into the laser peeling mechanism, and can be used to expedite the optimization of process parameters. Some preliminary purely numerical results using a finite element method (FEM) based software also are briefly discussed here.

Original languageEnglish
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791857533
DOIs
Publication statusPublished - 2015 Jan 1
EventASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015 - Houston, United States
Duration: 2015 Nov 132015 Nov 19

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10-2015

Other

OtherASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015
CountryUnited States
CityHouston
Period15-11-1315-11-19

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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    Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T., & Lin, M. C. (2015). Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. In Micro- and Nano-Systems Engineering and Packaging (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10-2015). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2015-50316