Thermal analysis of micro capillary pumped loop system

Chin Tsan Wang, Tzong Shyng Leu, Jui Ming Yu, Yuh Chung Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A Capillary Pumped Loop is a sort of "two-phase heat transport device". In this study, the micro capillary pumped loop (MCPL) and temperature sensors embedded in the micro-channels were fabricated using MEMS technology. An open type of MCPL was applied to determine the thermal analysis of MCPL corresponding to different injection volume flow rates under the condition of constant heating power 20W. A series of experiments yielded numerous results and are as follows: first, a larger injection volume flow rate results in a lower system temperature. Second, the thermal bubbles begin to degenerate into smaller bubbles at Q volume = 2 μl/min. In addition, the phenomenon of slug flow is observed with increasing injection volume flow rates, especially for the case of Q volume = 15 μl/min. Although the temperature of MCPL was reduced with the injection volume rate, the MCPL possessed an almost constant temperature difference regardless of injection volume flow rate. These findings will be useful in determining the optimal design of MCPL.

Original languageEnglish
Title of host publicationProceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009
Pages1175-1178
Number of pages4
EditionPART B
DOIs
Publication statusPublished - 2009
Event7th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2009 - Pohang, Korea, Republic of
Duration: 2009 Jun 222009 Jun 24

Publication series

NameProceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009
NumberPART B

Other

Other7th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2009
CountryKorea, Republic of
CityPohang
Period09-06-2209-06-24

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

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