This work presents the application of a newly developed numerical method to study the flow past a heated electronic component. The vortex shedding mechanism is described with the aid of a large-scale flow structure. The flow structure is also presented by streakline distributions. The computed pressure and heat flux distributions along the surface of the electronic component are discussed. Their relations with the vortex shedding are also presented.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanical Engineering
- Fluid Flow and Transfer Processes