Thermal and flow analysis of a heated electronic component

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33 Citations (Scopus)


This work presents the application of a newly developed numerical method to study the flow past a heated electronic component. The vortex shedding mechanism is described with the aid of a large-scale flow structure. The flow structure is also presented by streakline distributions. The computed pressure and heat flux distributions along the surface of the electronic component are discussed. Their relations with the vortex shedding are also presented.

Original languageEnglish
Pages (from-to)2261-2275
Number of pages15
JournalInternational Journal of Heat and Mass Transfer
Issue number12
Publication statusPublished - 2001 May 8

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


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