Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test

Tong Hong Wang, Chang Chi Lee, Yi Shao Lai, Yu Cheng Lin

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical results, we note that under coupled power and thermal cycling tests, reliability performances of a board-level stacked-die package should be similar as long as the total power dissipation prescribed to the package is identical, regardless of how the power distributes among separate dies.

Original languageEnglish
Pages (from-to)495-502
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Volume31
Issue number2 SPEC. ISS.
DOIs
Publication statusPublished - 2008 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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