The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical results, we note that under coupled power and thermal cycling tests, reliability performances of a board-level stacked-die package should be similar as long as the total power dissipation prescribed to the package is identical, regardless of how the power distributes among separate dies.
|Number of pages||8|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Issue number||2 SPEC. ISS.|
|Publication status||Published - 2008 Dec 1|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering