Thermal characteristics of InGaN/GaN flip-chip light emitting diodes with diamond-like carbon heat-spreading layers

Pai Yang Tsai, Hou Kuei Huang, Chien Min Sung, Ming Chi Kan, Yeong-Her Wang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.

Original languageEnglish
Article number829284
JournalInternational Journal of Photoenergy
Volume2014
DOIs
Publication statusPublished - 2014 Jan 1

Fingerprint

Diamond
Light emitting diodes
Diamonds
light emitting diodes
Carbon
diamonds
chips
heat
carbon
High temperature applications
Hot Temperature
Quantum efficiency
Temperature
temperature
quantum efficiency
Electric properties
Thermodynamic properties
Optical properties
thermodynamic properties
electrical properties

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Atomic and Molecular Physics, and Optics
  • Renewable Energy, Sustainability and the Environment
  • Materials Science(all)

Cite this

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title = "Thermal characteristics of InGaN/GaN flip-chip light emitting diodes with diamond-like carbon heat-spreading layers",
abstract = "The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9{\%} at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.",
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year = "2014",
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language = "English",
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Thermal characteristics of InGaN/GaN flip-chip light emitting diodes with diamond-like carbon heat-spreading layers. / Tsai, Pai Yang; Huang, Hou Kuei; Sung, Chien Min; Kan, Ming Chi; Wang, Yeong-Her.

In: International Journal of Photoenergy, Vol. 2014, 829284, 01.01.2014.

Research output: Contribution to journalArticle

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T1 - Thermal characteristics of InGaN/GaN flip-chip light emitting diodes with diamond-like carbon heat-spreading layers

AU - Tsai, Pai Yang

AU - Huang, Hou Kuei

AU - Sung, Chien Min

AU - Kan, Ming Chi

AU - Wang, Yeong-Her

PY - 2014/1/1

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N2 - The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.

AB - The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.

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