Thermal characteristics of InGaN/GaN flip-chip light emitting diodes with diamond-like carbon heat-spreading layers

Pai Yang Tsai, Hou Kuei Huang, Chien Min Sung, Ming Chi Kan, Yeong Her Wang

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.

Original languageEnglish
Article number829284
JournalInternational Journal of Photoenergy
Volume2014
DOIs
Publication statusPublished - 2014

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Atomic and Molecular Physics, and Optics
  • Renewable Energy, Sustainability and the Environment
  • Materials Science(all)

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