Abstract
The chirp fiber bragg grating (CFBG) created using the substrate-straining technique requires an invariable center wavelength when subjected to a temperature change. To accomplish this task, a secondary substrate is attached to one side of the main substrate in a bimetallic beam configuration, used as a thermal compensator. However, when the temperature changes, the strain along the CFBG is not uniform because the main substrate is not prismatic. A systematic method based on the shape optimization technique was developed to determine the geometry of the second substrate for temperature compensation. The results show that the second substrate, determined using shape optimization, can produce the required strain distribution to compensate for the center wavelength shift in a CFBG due to temperature changes. Although the thermal compensation of a CFBG demonstrated here is simple, it should be emphasized that this methodology can be easily applied to determine the substrate profile for thermal compensation in other FBG-bonded substrates with nonuniform cross sections.
| Original language | English |
|---|---|
| Pages (from-to) | 188-193 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Advanced Packaging |
| Volume | 27 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2004 Feb 1 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
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Thermal compensation for a chirp fiber Bragg grating bonded substrate. / Chang, Y. M.; Cheng, Chih Chun; Lo, Yu-Lung.
In: IEEE Transactions on Advanced Packaging, Vol. 27, No. 1, 01.02.2004, p. 188-193.Research output: Contribution to journal › Article
TY - JOUR
T1 - Thermal compensation for a chirp fiber Bragg grating bonded substrate
AU - Chang, Y. M.
AU - Cheng, Chih Chun
AU - Lo, Yu-Lung
PY - 2004/2/1
Y1 - 2004/2/1
N2 - The chirp fiber bragg grating (CFBG) created using the substrate-straining technique requires an invariable center wavelength when subjected to a temperature change. To accomplish this task, a secondary substrate is attached to one side of the main substrate in a bimetallic beam configuration, used as a thermal compensator. However, when the temperature changes, the strain along the CFBG is not uniform because the main substrate is not prismatic. A systematic method based on the shape optimization technique was developed to determine the geometry of the second substrate for temperature compensation. The results show that the second substrate, determined using shape optimization, can produce the required strain distribution to compensate for the center wavelength shift in a CFBG due to temperature changes. Although the thermal compensation of a CFBG demonstrated here is simple, it should be emphasized that this methodology can be easily applied to determine the substrate profile for thermal compensation in other FBG-bonded substrates with nonuniform cross sections.
AB - The chirp fiber bragg grating (CFBG) created using the substrate-straining technique requires an invariable center wavelength when subjected to a temperature change. To accomplish this task, a secondary substrate is attached to one side of the main substrate in a bimetallic beam configuration, used as a thermal compensator. However, when the temperature changes, the strain along the CFBG is not uniform because the main substrate is not prismatic. A systematic method based on the shape optimization technique was developed to determine the geometry of the second substrate for temperature compensation. The results show that the second substrate, determined using shape optimization, can produce the required strain distribution to compensate for the center wavelength shift in a CFBG due to temperature changes. Although the thermal compensation of a CFBG demonstrated here is simple, it should be emphasized that this methodology can be easily applied to determine the substrate profile for thermal compensation in other FBG-bonded substrates with nonuniform cross sections.
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U2 - 10.1109/TADVP.2004.825374
DO - 10.1109/TADVP.2004.825374
M3 - Article
VL - 27
SP - 188
EP - 193
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
SN - 1521-3323
IS - 1
ER -