Thermal management and novel package design of high power light-emitting diodes

Kuan Chun Chen, Y. K. Su, C. L. Lin, Yu Hsuan Lu, Wen Ng Li, Wen-Kuei Chuang, Jin Quan Huang, Shi Ming Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Thermal management and package materials in high power light emitting diodes (HPLEDs) are now critical design issues to limit their luminous intensity, reliability, and applications. In this paper Electroless and Electroplating techniques (EET) were both applied in fabrication of the red, green, and blue HPLEDs (RGB HPLEDs) chips. The HPLEDs with conventional package structures were fixed on the lead frames by adhesives, but the HPLEDs using EET were fixed on copper substrates without any adhesive resin. In our work, the results show that the thermal resistance of HPLED using EET is much less than one of the HPLED using adhesive resin. The maximum luminous intensity of the single chip HPLED using EET is larger than HPLED with resin/MCPCB (metal core printed circuit board) in room temperature.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages795-797
Number of pages3
DOIs
Publication statusPublished - 2008 Sep 15
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 2008 May 272008 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period08-05-2708-05-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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