Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

H. C. Tseng; P. H. Lee; J. H. Chou

doi:10.1109/ICEPT.2007.4441415

Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

H. C. Tseng, P. H. Lee, J. H. Chou

Department of Engineering Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

Original language	English
Title of host publication	Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs	https://doi.org/10.1109/ICEPT.2007.4441415
Publication status	Published - 2007
Event	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duration: 2007 Aug 14 → 2007 Aug 17

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other	2007 8th International Conference on Electronic Packaging Technology, ICEPT
Country/Territory	China
City	Shanghai
Period	07-08-14 → 07-08-17

All Science Journal Classification (ASJC) codes

General Engineering

Access to Document

10.1109/ICEPT.2007.4441415

Cite this

Tseng, H. C., Lee, P. H., & Chou, J. H. (2007). Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT Article 4441415 (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441415

@inproceedings{6b14a35e3a724dc0a3e3139ec5dec1b2,

title = "Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers",

abstract = "A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.",

author = "Tseng, {H. C.} and Lee, {P. H.} and Chou, {J. H.}",

year = "2007",

doi = "10.1109/ICEPT.2007.4441415",

language = "English",

isbn = "1424413923",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

booktitle = "Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

Tseng, HC, Lee, PH & Chou, JH 2007, Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers. in Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT., 4441415, Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 07-08-14. https://doi.org/10.1109/ICEPT.2007.4441415

Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers. / Tseng, H. C.; Lee, P. H.; Chou, J. H.
Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441415 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

AU - Tseng, H. C.

AU - Lee, P. H.

AU - Chou, J. H.

PY - 2007

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N2 - A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

AB - A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

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T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT

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Tseng HC, Lee PH, Chou JH. Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441415. (Proceedings of the Electronic Packaging Technology Conference, EPTC). doi: 10.1109/ICEPT.2007.4441415

Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

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