Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

H. C. Tseng, P. H. Lee, Jung-Hua Chou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

Original languageEnglish
Title of host publicationProceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China
Duration: 2007 Aug 142007 Aug 17

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2007 8th International Conference on Electronic Packaging Technology, ICEPT
CountryChina
CityShanghai
Period07-08-1407-08-17

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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    Tseng, H. C., Lee, P. H., & Chou, J-H. (2007). Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT [4441415] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441415