Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

Chi Ming Lai, Shuichi Hokoi

Research output: Contribution to journalArticlepeer-review

49 Citations (Scopus)

Abstract

This study combined building construction practice, microencapsulated phase change materials (mPCM), and aluminum honeycomb structures to construct an mPCM honeycomb wallboard prototype. The heat transfer characteristics and thermal storage behaviors of this prototype and other modules (mPCM only, mPCM + EG, and mPCM + iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and enhancing the thermal conductivity in the prototype rapidly transferred the heat flux into the mPCM. Consequently, the latent heat can be used to increase the time lag of the peak load, effectively shifting the peak hours of electricity use in the summer and achieving a lower module surface temperature than other modules. Thus, the mPCM + honeycomb exhibited better control over the surface temperature, which makes it suitable for use in places where the exterior surface temperature must be controlled. A correlation of the effective thermal protection duration of the mPCM + honeycomb modules for Ste5 = 2-5 and Sc1 = 0.24-0.32 was proposed.

Original languageEnglish
Pages (from-to)37-47
Number of pages11
JournalEnergy and Buildings
Volume73
DOIs
Publication statusPublished - 2014 Apr

All Science Journal Classification (ASJC) codes

  • Civil and Structural Engineering
  • Building and Construction
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM'. Together they form a unique fingerprint.

Cite this