Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

Shyy Woei Chang, Kuei Feng Chiang, Fang Chou Lin, Wei Sheng Hung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal performances of two loop heat pipes driven by capillary force (CF) and pumping force (PF) using R245a as working fluid were experimentally studied. The variations responsive to the adjustments of heating power, condenser cooling condition and flow rate of working fluid for the average Nusselt numbers of evaporator and condenser, the heat transmission networks, the total thermal resistances and the cooling power consumptions for the CF and PF loop heat pipes were comparatively examined. A selective set of experimental data demonstrated the improvements of thermal performance for the PF loop heat pipe due to the increased vapor-liquid circulation rates and the modified pressure drop characteristics along the loop. The dominant physics for the thermal performance improvements from the CF references were discussed. A set of empirical correlations that permitted the evaluation of the total thermal resistances of the PF loop were devised to assist the relevant engineering applications. Justified by the vanished start-up limit and the reductions of thermal resistance disclosed by the present preliminary study, the research focuses for the technology advancement of the forced convective loop heat pipe was recommended.

Original languageEnglish
Title of host publicationProceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
PublisherIEEE Computer Society
Pages113-123
Number of pages11
ISBN (Electronic)9781728197647
DOIs
Publication statusPublished - 2020 Jul
Event19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
Duration: 2020 Jul 212020 Jul 23

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2020-July
ISSN (Print)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Country/TerritoryUnited States
CityVirtual, Orlando
Period20-07-2120-07-23

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid'. Together they form a unique fingerprint.

Cite this